JFP DIE BONDERS
Our die bonders achieve high accuracy placement, using adjustable magnification optical device.
Functionnalities : stamping, eutectic and epoxy.
User friendly, flexible, our Die Bonders require only minimum training to operate.
The PP-One Platform designed for
accurate Pick & Place of delicate devices
is a perfect tool for handling Laser
The machine provides a simple solution for automatic placement of spacers devices, using a combination, of automatic Bars and Spacer Stackers.
UNIVERSAL DIE BONDER
It's the most versatile semi automatic Pick & Place platform. It can be used in a
wide field of applications such as ASIC, MMIC, MEMS or VECEL.
PP5 and PP6 are user friendly, flexible and requires minimal training to operate.
Eutectic and Epoxy available.
PP-7 Flexible Rework station
The PP-7 Rework Station is a complete solution semi automatic Flip-Chip and flexible rework plateform.
It is able to:
Pick & Place, Sort chips from a wafer, Dispense Epoxy, Stamp glue, Reflow solder paste, and Achieve Eutectic Bonds.