Die Bonders Fond texte Die Bonder

High quality
optical device

Die Bonder

Eutectic

Die Bonder

Epoxy

JFP DIE BONDERS

Our die bonders achieve high accuracy placement, using adjustable magnification optical device.

Functionnalities : stamping, eutectic and epoxy.

User friendly, flexible, our Die Bonders require only minimum training to operate.

mini-place-system Mini-Place-System Fond texte

Mini-Placer

MPS Mini-Place-System

Very light Epoxy Die Bonder solution,
MPS requires minimal training to operate

The MPS fulfils accurate Picking and Placement of delicate devices.

Tool holder design, rocking Head, provides an easy solution for gluing.

+

information

placer PP1-Placer Fond texte

MANUAL PLACER

PP-ONE Manual placer

Multipurpose plateform for pick and place. Small production ( < 500 000 pieces/year). The Manual Sorter PP-One model is designed for accurate Picking and Placement of delicate devices as Laser Diodes and Laser Bars.

The machine will pick the components from wafer hoops to place them into GelPack or Waffle Packs.

+

information

die bonder PP6 Die Bonder Fond texte

UNIVERSAL DIE BONDER

PP6 series

It's the most versatile semi automatic Pick & Place platform. It can be used in a wide field of applications such as ASIC, MMIC, MEMS or VECEL.

PP5 and PP6 are user friendly, flexible and requires minimal training to operate.

Eutectic and Epoxy available.

+

information

die bonder PP7 3 dimensions Fond texte

MULTILEVEL APPLICATION

PP7 series

3 Dimension Die Bonder.