Die Bonders Fond texte Die Bonder

High quality
optical device

Die Bonder

Eutectic

Die Bonder

Epoxy

JFP DIE BONDERS

Our die bonders achieve high accuracy placement, using adjustable magnification optical device.

Functionnalities : stamping, eutectic and epoxy.

User friendly, flexible, our Die Bonders require only minimum training to operate.

Stacker PP1-Placer Fond texte

STACKER

PP-ONE stacker

The PP-One Platform designed for accurate Pick & Place of delicate devices is a perfect tool for handling Laser Diodes/Bars.

The machine provides a simple solution for automatic placement of spacers devices, using a combination, of automatic Bars and Spacer Stackers.

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die bonder PP6 Die Bonder Fond texte

UNIVERSAL DIE BONDER

PP6 series

It's the most versatile semi automatic Pick & Place platform. It can be used in a wide field of applications such as ASIC, MMIC, MEMS or VECEL.

PP5 and PP6 are user friendly, flexible and requires minimal training to operate.

Eutectic and Epoxy available.

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Rework Station PP7 Rework Station Fond texte

REWORK STATION

PP-7 Flexible Rework station

The PP-7 Rework Station is a complete solution semi automatic Flip-Chip and flexible rework plateform.

It is able to:
Pick & Place, Sort chips from a wafer, Dispense Epoxy, Stamp glue, Reflow solder paste, and Achieve Eutectic Bonds.

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mini-place-system Mini-Place-System Fond texte

Mini-Placer

MPS Mini-Place-System

Very light Epoxy Die Bonder solution,
MPS requires minimal training to operate

The MPS fulfils accurate Picking and Placement of delicate devices.

Tool holder design, rocking Head, provides an easy solution for gluing.

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