WELCOME

 

TO

 

 

 

JFP Microtechnic

Deeply involved  in development and production of process integration, over 25 years  in the field of Assembly, Test and Packaging

This long experience and solid partnership with our customers, resulted in development of  standard and modular platforms

JFP Microtechnic, offers his experience, of high performances,

 precise, accurate, flexible and reliable equipments,

 to fulfil customer requirements

. Specific customer requirements and  application integration,

  Complex automated process

we design automated solutions,

 Production equipments

 

 

 

JFP Microtechnic

 

Design & Manufacture Equipments

 

For

 

Electronics industry

 

Hybrid

 

Micro-Wave devices

 

Opto-Electronics

 

Sensors

 

Semiconductor

 

 

 

ASSEMBLY,

 Laboratory & small Production

DIE BONDERS

 

P&P , Micropositionning, 

 More Info: PP-ONE

Universal Die Bonder

  More Info: P5 Epoxy / Eutectic

 

Flip Chip  Die Bonder

Epoxy / Eutectic / Ultrasonic

  More Info: PP6 series

Rework Station  Hot Gas

    More Info: PP6 series

WIRE BONDERS

THIN WIRE & RIBBON

GOLD AND ALUMINIUM 

BALL BONDER

BUMP

Manual and Semi-Auto

   More Info:   WB-100-1

WEDGE BONDER

DEEP ACCESS

Manual and Semi-Auto

  More Info:  WB-100-2

 

SCRIBERS

Scriber /Breaker,  Laser Diodes

    More Info:   S100  3'' or 4''

Scriber , up to 6'' or 8''

       More Info:   S200

 

Wafer Breaker

Hard material

    More Info:  BRK-60R

 

LASER DIODES TEST

 

Opto Devices Characterization 

SEMI-AUTO & FULL AUTOMATIC

   More Info:  DBT-1000

 

 

 

PRODUCTION SOLUTIONS

 

DIE BONDERS

SEMI-AUTO & AUTOMATIC DIE BONDER

  EPOXY / EUTECTIC

    More Info:  PP400 SERIES

CUSTOMIZED SOLUTIONS

 

Automated Production

SCRIBER - BREAKER & AUTOMATIC SORTER

   More Info:  SBS 420

CRYSTAL BREAKER - AUTOMATIC SORTER & PLACER

    More Info:  CBS430

 

New and specific process integration


CONTACT JFP MAIL