JFP Model PP5-4 Epoxy Die Bonder

&

JFP Model PP5-5  Eutectic Die Bonder

 

Pick & Place Die Placer


The Die Bonder model PP5-4 is designed for accurate Placement of delicate devices, on substrates or customized packages. 

Very accurate Placement can be achieved using an optical zoom magnification, as per operator requirement.

 As the whole PP5 family,

 the model PP5-4, can place the component directly, as you see it,

also,  using the auto-centering capability, or the indexed positionning. 

A compact, robust and reliable mechanical concept, designed to be external vibration free. 

Easy to use, flexible, the PP5-2 requires only minimum training to operate.


DownLoad PP5 Universal Die Bonder -PDF File-

PP5-4 Epoxy Die Bonder Specifications:

Die size:  Standard from 200x200µm  (8x8 mil) , up to 25mm  (1'')
Larger size upon request, up to 150mm
Joystick: proportionnal speed  
Large Motorized Tables stroke
Substrate handling: up to 200x400mm
Vision : CCD color camera, 17'' TFT Monitor
Lights:  Direct and pen light or LED ring light
Optical Zoom X10 , Standard magnification up to  150X  
Electronical Crosshair generator  
Force :  10 to 700g, Optional Heavy force, Up to 5kg
Bond time: programmable
Scrub : programmable

Options:
- Manual Dispenser 
- Stamping 
- Dipping, Flux,
- UV insolator. 
- Manual Wafer sorter, with die ejector 
- PC driven control
- Automated Inspection for sorting

 
PP5-5 EUTECTIC DIE BONDER SPECIFICATIONS:
All PP5-4 capabilities are available
additionnal Specifications/Options
- Heated work-holder  
- Programmable Eutectic cycle
- Eutectic, digital control of ramp-up and down... 
- High temperature process
- Fast temperature Ramp-up BOOSTER
- Micro-jet Hot Gaz Gun for local reflow or eutectic