Easy to use, flexible, the PP5-3 requires only minimum training to operate.
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JFP Model PP5-7 Full Rework Station
JFP Model PP5-6 Flip Chip
The Flip Die Bonder model PP5-3 is designed for accurate Placement of delicate devices, on substrates or customized packages.
It achieves high accuracy placement, using high quality optical device, mounted on a fix and rigid
assembly.
The JFP Smart Video Mixer, with multi-windows capability, is a very
friendly tool for substrate and device video matching
Flip feature will allow a perfect alignment of parts and substrate, mixing both video
pictures.
The complete process is PC driven.
As the whole PP5 family,
the model PP5-3, can place the component directly, as you see it, as a regular die placer,
also, using the auto-centering capability, or the indexed positionning.
A compact, robust and reliable mechanical concept, designed to be external vibration free.
Easy to use, flexible, the PP5-3 requires only minimum training to operate.
JFP Model PP5-7 Full Rework Station
As a rework station , the JFP PP5-7 is able to:
Pick & Place
Sort chips from a wafer
Dispense Epoxy
Stamp glue
Reflow solder paste
Achieve Eutectic Bonds, with or without Preforms
Bond Flip Chip device, gluing, reflow or Ultrasonic
What makes it a Rework Station ?
JFP PP5-7 is able to:
Reflow or burn local chip with Hot gaz gun
Integrated and adjustable Shear Force, to remove the device;
Size of removed device can be as small as 300µm
Solder Bumps can removed precisely, by a vacuum nozzle
Glue residues can be levelled , removed and sucked up by a special vacuum nozzle
Let's know what will be the next item !!