JFP Model, PP-ONE

NEW

Multi-Purposes Placer

NEW

JFP Model PP-One 

         Manual Die Handling

           Assembly of small Parts in Micro-mechanical Field

           Manual Die or Chip Sorter


The Manual Die Placer model PP-One is designed to achieve fine placements of delicate devices.

Concept:     A.Y.S.Y.  Pick & Place.  (As.You.See.You... Pick & Place.)

 High flexibility and simple handling.  

To achieve a fine placement, the system is using 2 vertical Zooms.

No mechanical Offset, no Parallax  but direct Viewing..

For very small components,  when some adjustments are required, Operator will tune the Targeting  on the video Display, following the intuitive rules of A.Y.S.Y  Adjust. (As.You.See.You... Adjust)

Any deep Packages is acceptable, as large and flat substrate.

Device height up to 100mm


A compact, robust and reliable mechanical concept, 
Minimum training required to operate.

Options:

Glue:

A secondary head can be added for Gluing purposes (Stamping system or single dot dispenser)

Wafer Sorter:

Some of  the options of the PP5 can be used on the PP-One Platform.

The PP-One is a simple solution for wafer sorting, at the lab or R&D  level.

Wafer ejector system can be installed or removed in few seconds.

DownLoad PPOne -PDF File-

Specifications:
Die size: Flip from 200x200µm (8x8 mil) , up to 10mm 
Larger size upon request,
Large Work Access
Substrate handling: up to 200x400mm
Vision : 2 CCD color cameras
Monitor : 17'' TFT, multistandard
Lights: - Direct and ring LED lights available
-independant lighting for substrate camera and Pick camera
Zoom :    Optical, 10x 
Electronic Crosshair generator 
Force : 10 to 400g
Bond time: operator control
Scrub : on request

Compatible Options:

- Heated work-holder 
- Eutectic, 
- Manual Dispenser 
- Stamping 
- Dipping, Flux,
- UV insolator. 
- Manual Wafer sorter, with die ejector