JFP Model PP400
JFP Model PP400 series
Semi-Automatic Die Sorter Platform
The modular concept will offer a very large flexibility in machine configuration.
PP400 is a production oriented machine, for semi-automatic operations.
High accuracy placement is performed by fast, and stable pickup arm.
Multiple head concept will solve most requirements, customer process, or specific request
Pickup station, can be configurated for manual waffle packs or wafer sorter
Die size compatible from 250 µm, up to 20mm
Placement accuracy : std < 20µm
Optional High magnification configuration
Dry Pick & Place Cycle : <1,5 second
Large Pick-up Area: 200x200 mm or larger on request
Manually Handled Pick-up workholder
Programmable Area Substrate Workholder : 200x100 mm, or larger on request
Placement mode:
Fully manual, Matrix, Step&Repeat, Self teach mode and Off-Line File
PP400 Platform is compatible for indexing solutions:
Frames, Boats, Tape, Substrates, Packages...
Applications:
Wafer Sorter, single head
Epoxy Die Bonding, + dispenser, or stamping solution (dual head)
Eutectic Die Bonding, + pre-form + eutectic (dual head)
OPERATIONS
Pick:
- Operator is required for visual alignment before picking
- Pick Color Video camera, Optical Zoom and electronic video target, LED lighting, 17''Video Monitor
- Targeting mode is -You Pick as You See-
Place:
- Full manual mode, Operator will select the destination position as the targeting mode - You Place as You see-
- Semi-automatic mode, all destination positions, are related to one or two reference spots.
- All placement positions will be handled automatically, so operator just keep targeting the chips prior to pick them.
- Place Color Video camera, Optical Zoom and electronic video target, Led lightingr
- Targeting mode is -You Pick as You See- or Programmed mode
note:
Semiauto-mode is optimized for higher throughput, as operator might align the following chip, while bond head is placing the previous component.