JFP Model WB100-2 

JFP Model WB-100-2

Manual and Semi-Automatic WEDGE BONDER

 Multi-Stitch Capability

 

The WB-100 serie  is designed as a multi-purposes semi-automatic wire bond tool for R&D and small series production.

Its flat bench Top size allows easy carriage and also operation....

The machine provides a full Manual Z mode, for simple repair,  no programming dependant.

DownLoad WB100-2 specs -PDF File-

Since 10 years our WB100 is successful established on the wordwide market.

We have put all our efforts and experience in a versatile wire bond Tool.

 WB100 serie is a robust and reliable mechanical concept, easy to use, flexible for multiple applications.

SYSTEM

Table Top machine

StereoZoom Binocular

Wire: 17µm up to 50µm

Vertical Z motion

Motorized Z Bond Head

Optional Heated Stage

Tool heater controller

Motorized Wire spool

PARAMETERS

Digital programming

LCD Display

Bond force

Ultrasonic Time  

Ultrasonic Power

Loop Height

Tail Lenght

Storage: 20 recipes

Halogen lamp

Dual arm Fiber Lighting

Optional Camera is available

Applications:

Large choice of workHolders

Heated 

Height adjustable 

Mechanical Clamp or Vacuum