JFP Model PP410,
420,430
Automatic Wafer Sorter Epoxy and Eutectic Customized or Complex Process Solution JFP Model PP410, PP420, PP430 series
Automatic Platform
high density packages or substrates.
The modular concept will offer a very large flexibility of machine configuration
PP400 is a production oriented machine, for semi-automatic up to full automatic process.
High accuracy placement is performed by fast, and stable pickup arm.
Multiple head concept will solve most requirements, customer process, or specific request
Pattern recognition unit provides a stable and accurate placement,
Production , accuracy and repeatability are not operator dependant
Pickup Station is configurated for automatic Wafer Picking or WafflePack handling
Die size compatible from 250 µm, up to 15mm
Standard Placement accuracy : std < 20µm
With die preciser unit: < 10µm
Dry Pick&Place Cycle: < 1,5 second
Large pick-up Area: 200x200mm or 300x300 mm
Placement Mode:
Manual, Patrix, Step&Repeat, selfteach mode and Off-Line File
PP400 Platform is compatible for indexing solutions:
Frames, Boats, Tapes, Substrates, Packages...
Applications:
Wafer Sorter, single head / dual head for higher throughput,
Epoxy Die Bonding, + dispenser,or Stamping solution (dual head)
Eutectic Die Bonding, + pre-form + eutectic cycle (dual head)