JFP Model S200-6

General purpose Scriber.

Thin Glass, Borosilicate, Silicon, Alumina, Sapphire

Scribe Model 200-6 is easy to use for singulating components on up to 6’’ wafer.
Robust; vibration free the scribe 200 unit is immediately operational, with minimum training.
Vertical targeting is carried out with a video camera,
Monitor display includes an electronic crosshair.
A LCD screen allows parameters display and selected through programming wheel.

DownLoad S200 data sheet -PDF File-

Specifications:
Die size: programmable, up table limits
Thickness: from 3 mil and up
Diamond tool: adjustable angle & spin
Tool offset to Crosshair: electronic adjustment
Z motion with adjustable angle
X Y table / display 1µm
Joystick: proportionnal speed
Wafer chuck till 6"
Wafer hold by vacuum
Manual Rotation : 90 degrees
Fine Alignment by micrometric screw
Vision : High magnification optic system available, upon application
CCD color camera
Monitor : 17'' TFT, multistandard
Video Target generator for alignment
Lights: - Direct and pen LED lights,
Scribe Force : adjustable, 5 to 150g
Scribe speed: programmable
Scribe lenght : programmable
Single line or dot line capability
Repeat scribe capability
Touch down speed, adjustable
Cut counter for maintenance
Facilities:
Power: 100-240vac, Air: 70 PSI, Vacuum: 60%