The Laser Test Unit Model DBT-1000 is easy to use for Laser Diodes characterization.
P/I and P/T
Robust; vibration free the scribe 200 unit is immediately operational, with minimum training.
Vertical targeting is carried out with a video set including an electronic crosshair.
A LCD screen allows parameters display and selected through programming wheel.
During Test, Sensor and Test Unit are closely mounted, and require minimum connection links.

no DownLoad DBT data sheet -PDF File-

Specifications:
Die size: from 300x300µm 
Thickness: from 3 mil and up

2 basic configurations:
-Insulated Head for surface contact diode, upon customer requirements
-Dual Head for Pin contact configuration
Tool offset to Crosshair: electronic adjustment 
Z motion with adjustable angle
X Y table / display 1µm
Joystick: proportionnal speed 
Chip hold on chuck by vacuum
Peltier Test Chuck 
Temperature range: 0°C up to 100°C
Vision : High magnification optic system available, upon application
CCD color camera
Monitor : 17'' TFT, multistandard
Video Target generator for alignment
Lights: - Direct and pen LED lights,
Touch down speed, adjustable
Facilities:
Power: 100-240vac,  Air: 70 PSI,  Vacuum: 60%

 

JFP Model DBT-1200- SAM-TEST

Automatic Laser Diode Test.

The Automatic Laser Test Unit Model DBT-1200 is a full automated solution for Laser Diodes characterization.
Automatic Chip handling:
-Pickup from wafer
-automatic recognition for device handling
-Place on test chuck
-Place tested device on 4 GelPacks, upon sorting criteria.
Test Area includes:
-Dual photo-sensor or dual spheres.
-Two Test chucks for fast throughput,
-Reference device for calibration purpose
-Automatic recognition, for test pad centering
Communication interface with Test unit:
-test launching 
-test data for sorting purposes.
P/I and P/T

Vertical targeting is carried out with a video set including an electronic crosshair.
All parameters are linked and recorded together in one program application.
Sensors and Test Unit are build to require minimum connection links.

no DownLoad DBT1000 data sheet -PDF File-
Specifications:
Die size: from 250x250µm (10mil)
Thickness: from 75µm, (3 mil) and up

Basic configuration:
-Modul I -XYZ and Theta for Chip handling,
-Modul II -XYZ,hi resolution, for multi chuck Shuttle and pin Test centering
Pickup Tool offset to Crosshair: programmable 
Test Pin to crosshair: programmable.
Joystick: proportionnal speed 
Chip hold on chuck by vacuum
Two LCD display, used for wafer handling and for Test Monitoring.
Video Target generator for alignment
Lights: - Direct and pen LED lights,
Facilities:
Power: 100-240vac, Air: 70 PSI,  Vacuum: 60%