JFPM Breaker BRK-60R
HARD MATERIAL
Thin Glass, Borosilicate, Silicon, Alumina, Sapphire
WAFER BREAKER BRK-60R is easy to use for singulating very small components,
up to
2.5x2.5’’ wafer or substrate
Robust; the Breaker unitt is immediately operational, with minimum training.
Vertical targeting is carried out with a video camera, for angular alignment
Monitor display includes an electronic crosshair.
All parameters are directly adjusted on operator control panel.

Table Top machine
Motorized X&Y transfert Table
X&Y travel 100x100mm
Rotary Chuck for Angular alignment
Theta alignment done by micrometer
Dual RRollers system
High Breaking Force independantly adjustable X or Y
Substrate or wafer up to 60mm
Main Parameters
Breaking Speed adjustable X or Y
Dual Pass capability
Step Mode
Automatic Mode