JFPM Breaker BRK-60R

JFP Model BRK-60R

WAFER BREAKER

HARD MATERIAL

Thin Glass, Borosilicate, Silicon, Alumina, Sapphire


WAFER BREAKER BRK-60R  is easy to use for singulating very small components, 

 up to 2.5x2.5’’ wafer or substrate
Robust;  the Breaker unitt is immediately operational, with minimum training.
Vertical targeting is carried out with a video camera, for angular alignment
 Monitor display includes an electronic crosshair.
All  parameters are directly adjusted on operator control panel.


DownLoad BRK-60R data sheet -PDF File-

SYSTEM

Table Top machine

Motorized X&Y transfert Table

X&Y travel 100x100mm

Rotary Chuck for Angular alignment

Theta alignment done by micrometer

 

Specifications:

Dual RRollers system

High Breaking Force independantly adjustable X or Y


Minimal chip size, upon material and thickness

Substrate or wafer up to 60mm

 

Main Parameters

Breaking Speed  adjustable X or Y

Dual Pass capability

Step Mode

Automatic Mode

 

No tape is required
CCD color camera
Monitor : 17'' TFT, multistandard
Video Target generator for alignment
Lights: -  LED Ring  lights,


Facilities:
Power: 100-240vac, <1k WATTt

 Air: 70 PSI,

  Vacuum: >60%