Industries
Precision micro-assembly equipment for research, prototyping and small-series production.
Industries and research fields
JFP Microtechnic equipment is used for high-precision assembly, bonding, placement, scribing, inspection and testing applications. Our solutions are particularly suited to R&D, prototyping and small-series production, with equipment that can be adapted to specific processes and requirements.
R&D Laboratories
Flexible equipment for process development, prototyping and high-precision micro-assembly applications.
Universities
Versatile solutions for research, teaching and the development of new microelectronic and optoelectronic processes.
Semiconductor
Equipment for die bonding, wire bonding, wafer handling, scribing and other semiconductor assembly processes.
Optoelectronics
Precision solutions for the assembly, alignment, bonding and characterization of optoelectronic components.
Photonics
High-accuracy equipment for the placement, alignment and assembly of photonic and optical components.
Microelectronics
Solutions for precision placement, bonding, rework, inspection and testing of microelectronic components.
Medical Devices
Precision assembly equipment suited to the development and small-series production of miniature and sensitive components.
Aerospace & Defense
High-precision assembly and process equipment for demanding applications requiring accuracy, flexibility and repeatability.