PP6 Universal Die Bonder
Versatile semi-automatic flip-chip platform for high-accuracy placement and multiple die-bonding processes.
RESOURCES
Videos
See JFP Microtechnic equipment in operation, with machine demonstrations and application videos.
WB200e Manual & Semi-automatic Wire Bonder
Multi-purpose wire bonder for R&D, prototypes and small series, supporting manual, semi-automatic and optional Auto-Bond operation.
MS Manual Scriber
Compact high-precision manual scriber with true vertical vision, adjustable scribe force and fine X/Theta positioning.