Our equipment
Explore JFP Microtechnic equipment by machine category.
Die Bonders
JFP Microtechnic offers manual, semi-automatic and automated die bonding solutions for R&D, prototyping and small-series production. The range covers applications including flip-chip assembly, epoxy and eutectic bonding, thermocompression and reflow processes. Equipment can be selected according to component and substrate characteristics, placement accuracy and bonding process.
View equipment →Wire Bonders
JFP Microtechnic wire bonders are designed for R&D, prototyping and small-series production, with solutions ranging from manual operation to semi-automatic and automated processes. Equipment can be selected according to wire or ribbon, component geometry, bonding process and required level of automation.
View equipment →Scribers
JFP Microtechnic offers precision scribing equipment for R&D, prototyping and small-series production. Manual and motorized solutions provide accurate positioning and controlled scribing for wafers and other substrates. Equipment can be selected according to substrate characteristics, dimensions, required positioning accuracy and process requirements.
View equipment →Laser Stacker / Tester
Solutions for laser diode characterization, stacking and unstacking.
View equipment →Rework Stations
JFP Microtechnic rework equipment is designed for precise component removal, handling and replacement in R&D, prototyping and small-series environments. Equipment can be selected according to component type, substrate, assembly process and rework operation.
View equipment →Inspection Camera
Optical inspection solutions for micro-assembly, bonding and placement control.
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