JFP Microtechnic
Die Bonders
JFP Microtechnic offers manual, semi-automatic and automated die bonding solutions for R&D, prototyping and small-series production. The range covers applications including flip-chip assembly, epoxy and eutectic bonding, thermocompression and reflow processes. Equipment can be selected according to component and substrate characteristics, placement accuracy and bonding process.
Our machines
MPS - Manual Placer System
Compact manual placer for accurate pick-and-place of delicate devices, with true vertical vision, flip-chip alignment and options for dispensing, stamping, reflow and eutectic processes.
PP-ONE Automated XZ
Automated micro-placer and sorter for delicate IC devices, laser diodes, sensors and micro-mechanical parts, with wafer handling and dispensing or stamping options.
WB300 Ultrasonic & Reflow Die Bonder
High-accuracy die bonder combining flip-chip vision with thermosonic, thermocompression, eutectic and reflow capabilities.
PP6 Universal Die Bonder
Versatile semi-automatic flip-chip platform for high-accuracy placement and multiple die-bonding processes.
PP7 3D
Multi-level die bonder for accurate placement on packages with different reference heights, including delicate devices such as IR sensors and MEMS.
Customized Equipment
Custom equipment developed on request for specific micro-assembly processes. One example is a PP6 Laser Machine using laser-beam reflow.