PP7 3D
Multi-level die bonder for accurate placement on packages with different reference heights, including delicate devices such as IR sensors and MEMS.
Key features
- Multi-level die placement
- Programmable focusing independent of bonding height
- Orthogonal and coaxial vision motions
- UHD optical alignment
- Indexed pick-and-place
- High-accuracy placement on reference packages
- Compatible with delicate devices such as IR sensors and MEMS
- External vibration-free design
Technical specifications
Die & substrate
- Minimum die size: 100 × 100 µm
- Maximum die size: 20 × 20 mm; larger by option
- Substrate handling: up to 200 × 300 mm
Vision system
- UHD cameras: 5 MP or 18 MP
- Powerful digital zoom
- 17-inch TFT monitor
- Oblique and coaxial LED lighting
- 2-point auto-centering
Motion & process
- Motorized X travel: 260 mm
- Motorized Y travel: 120 mm
- Programmable force: 10–700 g
- Additional bond force: up to 5 kg
- Programmable bond time and scrub
- Programmable focus range: 20 mm
Facilities
- Power: 230 VAC, 1 kVA
- Vacuum: < 0.1 bar
- Compressed air: 6 bar
- Dimensions: 650 × 820 × 1450 mm
- Weight: 110 kg
For the complete specification and available configurations, download the official JFP Microtechnic documentation.
Download documentationRelated equipment
Need help with your application?
Contact JFP Microtechnic to discuss your process, required accuracy and equipment configuration.
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