JFP MICROTECHNIC

Micro Assembly
Solutions

Founded in 1992, JFP Microtechnic provides solutions for assembly, nano-microelectronic and optoelectronic applications.

Based in Marcoussis, south of Paris, France.

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Our equipment

JFP Microtechnic develops equipment for high-precision microelectronic and optoelectronic assembly processes.

Die Bonders

JFP Microtechnic offers manual, semi-automatic and automated die bonding solutions for R&D, prototyping and small-series production. The range covers applications including flip-chip assembly, epoxy and eutectic bonding, thermocompression and reflow processes. Equipment can be selected according to component and substrate characteristics, placement accuracy and bonding process.

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Wire Bonders

JFP Microtechnic wire bonders are designed for R&D, prototyping and small-series production, with solutions ranging from manual operation to semi-automatic and automated processes. Equipment can be selected according to wire or ribbon, component geometry, bonding process and required level of automation.

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Scribers

JFP Microtechnic offers precision scribing equipment for R&D, prototyping and small-series production. Manual and motorized solutions provide accurate positioning and controlled scribing for wafers and other substrates. Equipment can be selected according to substrate characteristics, dimensions, required positioning accuracy and process requirements.

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Laser Stacker / Tester

Solutions for laser diode characterization, stacking and unstacking.

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Rework Stations

JFP Microtechnic rework equipment is designed for precise component removal, handling and replacement in R&D, prototyping and small-series environments. Equipment can be selected according to component type, substrate, assembly process and rework operation.

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