JFP Microtechnic
Wire Bonders
JFP Microtechnic wire bonders are designed for R&D, prototyping and small-series production, with solutions ranging from manual operation to semi-automatic and automated processes. Equipment can be selected according to wire or ribbon, component geometry, bonding process and required level of automation.
Our machines
WB100e Manual & Semi-automatic Wire Bonder
Versatile manual and semi-automatic wire bonder for R&D, prototypes and small-series production, with wedge and ball bonding capability.
WB200e Manual & Semi-automatic Wire Bonder
Multi-purpose wire bonder for R&D, prototypes and small series, supporting manual, semi-automatic and optional Auto-Bond operation.
MPT Manual Pull Tester
Compact pull tester for destructive and non-destructive evaluation of bond quality on fine bonded wires.