WB100e Manual & Semi-automatic Wire Bonder
Versatile manual and semi-automatic wire bonder for R&D, prototypes and small-series production, with wedge and ball bonding capability.
Key features
- Wedge and ball bonding
- Motorized Z bond head
- Semi-automatic and manual modes
- Deep-access bond head
- Automatic motorized wire feeder
- Electronic flame-off and missing-ball detection
- Unlimited Ball / Wedge recipes
- Optional manual Z mode and loop profile
Applications
Technical specifications
System
- Table-top machine
- Wire diameter: 17–50 µm
- Bond arm length: 165 mm
- Throat depth: 200 mm
- Motorized Z travel: 40 mm
- Motorized Step Back Y: 20 mm
- Manipulator ratio: 8:1
Bonding
- Ultrasonic system: PLL, 62 kHz
- Ultrasonic power: 0–5 W
- Bond time: 0–10,000 ms
- Force: 10–150 cN
- Capillary tool: 1.58 mm diameter
Controls
- 10-inch touch screen
- Graphic display
- Programmable bond force, time and power
- Loop height / profile
- Search height and tail length
- Automatic bond-height detection
Workholder
- Heated workholder up to 250°C
- Temperature control: ±1°C
- Work height: 100 mm
- Height adjustment for parts up to 20 mm thick
Facilities
- Electrical: 100 / 240 V, 50–60 Hz
- Current: max. 5 A
- Dimensions: 450 × 600 × 500 mm
- Weight: 27 kg
For the complete specification and available configurations, download the official JFP Microtechnic documentation.
Download documentationProcess details
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