Applications
Ball bonding
JFP Microtechnic equipment related to this application.
Equipment for this application
WB100e Manual & Semi-automatic Wire Bonder
Versatile manual and semi-automatic wire bonder for R&D, prototypes and small-series production, with wedge and ball bonding capability.
WB200e Manual & Semi-automatic Wire Bonder
Multi-purpose wire bonder for R&D, prototypes and small series, supporting manual, semi-automatic and optional Auto-Bond operation.
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