JFP Microtechnic
Scribers
JFP Microtechnic offers precision scribing equipment for R&D, prototyping and small-series production. Manual and motorized solutions provide accurate positioning and controlled scribing for wafers and other substrates. Equipment can be selected according to substrate characteristics, dimensions, required positioning accuracy and process requirements.
Our machines
MS Manual Scriber
Compact high-precision manual scriber with true vertical vision, adjustable scribe force and fine X/Theta positioning.
S100 Semi-automatic Scriber Breaker
Semi-automatic scribe-and-break system for delicate GaAs and silicon dies, designed to keep finished dies clean and minimize damage.
S200 Automatic Scriber
8-inch diamond scriber for precise singulation of silicon, LED GaAs, alumina, thin glass, borosilicate and sapphire components.
SBS420 Full Automatic System
Fully automatic scribing, breaking, inspection and sorting system for delicate components such as borosilicate lids.
UV810 - UV Curing System
Compact UV-A 365 nm curing system for UV tape used in wafer dicing and back-grinding processes.