S100 Semi-automatic Scriber Breaker
Semi-automatic scribe-and-break system for delicate GaAs and silicon dies, designed to keep finished dies clean and minimize damage.
Key features
- Combined scribing and breaking
- Suitable for delicate GaAs and silicon dies
- Programmable scribing parameters
- Semi-automatic breaking mode
- High-resolution XY motion
- Electronic zoom and UHD vision
- Tape and dry-chuck processing
- Vibration-free design
Applications
Technical specifications
Scribing head
- Adjustable Z angle
- Scribing force: 10–100 g
- Diamond tool angle and rotation adjustment
- Crosshair tool offset
Wafer table
- Wafer chuck up to 4 inches
- Die size: 100 µm square to 10 × 10 mm
- Wafer thickness: 50 µm and up
- XY resolution: 0.23 µm
- Repeat / accuracy on blue tape: ±5 µm
Vision
- UHD color camera
- Electronic zoom ×10
- 17- and 21-inch TFT monitor configurations
- LED lighting
Breaker
- Operator-controlled or semi-automatic break mode
- Top rubber and bottom cutter breaking system
Facilities
- Power: 100 / 230 VAC, 0.5 kW
- Air: 70 psi
- Vacuum: 60%
- Dimensions: 650 × 820 × 130 mm
- Weight: 70 kg
For the complete specification and available configurations, download the official JFP Microtechnic documentation.
Download documentationProcess details
Videos
S100 scribing Caméra Inspection
Scriber&breaker JFP/S100
Related equipment
Need help with your application?
Contact JFP Microtechnic to discuss your process, required accuracy and equipment configuration.
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