SBS420 Full Automatic System
Fully automatic scribing, breaking, inspection and sorting system for delicate components such as borosilicate lids.
Key features
- Fully automatic scribe-break-sort process
- Designed for delicate borosilicate lids
- Integrated inspection before sorting
- Programmable breaking force
- High-resolution UHD vision
- Motorized wafer alignment and rotation
- 1 µm XY motion resolution
- Robust vibration-free design
Applications
Technical specifications
Scribing head
- Y/Z motion with adjustable angle
- Scribing force: 10–150 g
- Adjustable diamond-tool angle and rotation
- Crosshair tool offset
Wafer table
- Wafer chuck up to 3 inches
- Die size: 200 µm square to 10 × 10 mm
- Wafer thickness: 100 µm and up
- Motorized 90° rotation
- XY motion resolution: 1 µm
Vision & inspection
- UHD cameras: 18 MP
- Standard FOV: 2.7 mm
- Pixel resolution: 0.55 µm/pixel
- Digital zoom ×10
- 22-inch TFT monitor
- Integrated inspection system
Sorting
- Pallet size: 7 × 7 inches
- Cycle time: 1.9 s
- Programmable force
Facilities
- Power: 100 / 230 VAC, 50 W
- Air: 70 psi
- Vacuum: 60%
- Dimensions: 1210 × 1073 × 1400 mm
- Weight: 280 kg
For the complete specification and available configurations, download the official JFP Microtechnic documentation.
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