Applications
Scribing
Scribing creates a controlled line on a wafer or other substrate, typically in preparation for separation into individual dies or components. The process requires accurate positioning and controlled scribing according to the substrate and required geometry.
Equipment for this application
MS Manual Scriber
Compact high-precision manual scriber with true vertical vision, adjustable scribe force and fine X/Theta positioning.
S100 Semi-automatic Scriber Breaker
Semi-automatic scribe-and-break system for delicate GaAs and silicon dies, designed to keep finished dies clean and minimize damage.
S200 Automatic Scriber
8-inch diamond scriber for precise singulation of silicon, LED GaAs, alumina, thin glass, borosilicate and sapphire components.
SBS420 Full Automatic System
Fully automatic scribing, breaking, inspection and sorting system for delicate components such as borosilicate lids.
Looking for a specific configuration?
Contact JFP Microtechnic to discuss your process, required accuracy and equipment configuration.
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