S200 Automatic Scriber
8-inch diamond scriber for precise singulation of silicon, LED GaAs, alumina, thin glass, borosilicate and sapphire components.
Key features
- Wafer handling from 2 to 8 inches
- Programmable angular scribing
- High-precision XY table
- Adjustable diamond-tool angle and rotation
- Programmable scribe speed and length
- Video targeting with electronic crosshair
- Suitable for multiple brittle materials
- Robust vibration-free platform
Technical specifications
Scribing head
- Adjustable Z angle
- Scribing force: 10–300 g
- Diamond tool angle and rotation adjustment
- Crosshair tool offset
Wafer table
- Wafer / chuck: 2 to 8 inches
- Vacuum hold
- Frame / ring adaptor
- Continuous programmable rotation
- XY display: 1 µm
- XY accuracy: ±5 µm
Vision
- Standard field: 1 mm
- 17-inch TFT monitor
- High-definition color camera
- Target generator
- Vertical and oblique LED lighting
Parameters
- Y scribe speed: 1–100 mm/s
- Programmable scribe length
- Repeat scribe
- Programmable circle on substrate available on request
- Cut counter
Materials
- Silicon
- LED GaAs
- Alumina
- Thin glass
- Borosilicate
- Sapphire
Facilities
- Power: 100 / 230 VAC, 50 W
- Air: 70 psi
- Vacuum: 60%
- Dimensions: 650 × 820 × 130 mm
- Weight: 70 kg
For the complete specification and available configurations, download the official JFP Microtechnic documentation.
Download documentationVideos
Related equipment
Need help with your application?
Contact JFP Microtechnic to discuss your process, required accuracy and equipment configuration.
Contact JFP Microtechnic