JFP Microtechnic
Rework Stations
JFP Microtechnic rework equipment is designed for precise component removal, handling and replacement in R&D, prototyping and small-series environments. Equipment can be selected according to component type, substrate, assembly process and rework operation.
Our machines
PP6 Rework & Die Bonder Station
High-accuracy rework and die-bonding platform for die removal, bond-area preparation, solder-ball removal and precise replacement of delicate devices.
Gas-Gun Manual Eutectic Station
Manual hot-gas station for versatile soldering, eutectic and reflow processes in microelectronics.