PP6 Rework & Die Bonder Station
High-accuracy rework and die-bonding platform for die removal, bond-area preparation, solder-ball removal and precise replacement of delicate devices.
Key features
- Accurate die removal and replacement
- Local hot-gas removal with adjustable shear
- Bond-area planning and solder-ball removal
- Placement accuracy better than 5 µm stated for rework placement
- Pick-and-place from wafer, WafflePack, Gel-Pak or bulk media
- Compatible with very small dies below 200 µm
- Programmable force, time, scrub and temperature ramp
- Automated XYZ process
Technical specifications
Die & substrate
- Minimum die size: 150 × 200 µm
- Maximum die size: 20 × 20 mm
- Substrate: up to 300 mm standard
Vision
- UHD cameras: 18 MP
- Standard FOV: 2.7 mm
- Pixel resolution: 0.55 µm/pixel
- Digital zoom ×10
- 22-inch TFT monitor
- Coaxial and oblique LED lighting
Rework & placement
- Hot gas gun
- Programmable force: up to 700 g
- Programmable bond time and scrub
- Programmable temperature ramp-up
- Direct face-up placement
- 2-point auto-centering
- Indexed pick and multi-placement
Motorized tables
- X travel: 260 mm
- Y travel: 120 mm
- Step resolution: 0.23 µm
- Display unit: 1 µm
Facilities
- Power: 230 VAC, 1 kW
- Vacuum: 70%
- Dimensions: 650 × 820 × 1450 mm
- Weight: 90 kg
For the complete specification and available configurations, download the official JFP Microtechnic documentation.
Download documentationProcess details
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