PP6 Universal Die Bonder
Versatile semi-automatic flip-chip platform for high-accuracy placement and multiple die-bonding processes.
Key features
- Multiple-process universal die bonding platform
- Face-up and face-down placement
- Flip-chip vision for small and large devices
- Automated die-bonding sequences
- Programmable epoxy patterns and multi-placement
- High-accuracy UHD vision
- Wafer, WafflePack, Gel-Pak, tray and bulk-die input
- External vibration-free design
Technical specifications
Die & substrate
- Minimum die size: 70 × 70 µm
- Maximum die size: 40 × 40 mm
- Maximum substrate size: 400 × 250 mm
- Input: Gel/Waffle Pack, tray, wafer eject/sorter and bulk die
- Long laser bars supported
Vision system
- UHD video microscope cameras: 18 MP
- Standard field of view: 2.7 mm
- Pixel resolution: 0.55 µm/pixel
- Digital zoom ×10
- 22-inch TFT monitor
- Coaxial and oblique LED lighting
Process & parameters
- Programmable force up to 700 g
- Programmable bond time
- Programmable scrub
- Programmable temperature ramp-up
- Programmable sequences
- Indexed pick and multi-placement
Alignment
- Direct face-up placement
- 2-point auto-centering
- Optional face-down flip-chip alignment
Options
- Eutectic chuck with gas environment: 25°C to 450°C
- Formic acid process
- Dispensing / stamping
- Additional force up to 5 or 15 kg
- Wafer eject/sorter
- Hot gas gun
- Heated tool up to 400°C
- UV insolator
Motorized tables
- X travel: 260 mm
- Y travel: 120 mm
- Step resolution: 0.23 µm
- Display unit: 1 µm
- Joystick control
For the complete specification and available configurations, download the official JFP Microtechnic documentation.
Download documentationProcess details
Videos
Project Bar Assy
Eutectic AuSi
Related equipment
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Contact JFP Microtechnic to discuss your process, required accuracy and equipment configuration.
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