Applications
Formic acid process
JFP Microtechnic equipment related to this application.
Equipment for this application
No standard machine is currently listed for this application. Contact JFP Microtechnic to discuss a specific configuration.
Available with optional configuration
Optional configuration
WB300 Ultrasonic & Reflow Die Bonder
High-accuracy die bonder combining flip-chip vision with thermosonic, thermocompression, eutectic and reflow capabilities.
Optional configuration
PP6 Universal Die Bonder
Versatile semi-automatic flip-chip platform for high-accuracy placement and multiple die-bonding processes.
Looking for a specific configuration?
Contact JFP Microtechnic to discuss your process, required accuracy and equipment configuration.
Contact JFP Microtechnic