WB300 Ultrasonic & Reflow Die Bonder
High-accuracy die bonder combining flip-chip vision with thermosonic, thermocompression, eutectic and reflow capabilities.
Key features
- High-accuracy die placement
- Flip-chip vision alignment
- Thermosonic and thermocompression capabilities
- Eutectic and reflow capabilities
- Glue or paste dispensing capability
- High-magnification optical alignment
- Vacuum single-collet pick-and-place
- External vibration-free design
Technical specifications
Die & substrate
- Minimum die size: 70 × 70 µm
- Maximum die size: 15 × 15 mm
- Compatible with packages up to 100 mm thick
Vision system
- UHD video microscope camera: 5 MP
- Standard field of view: 14.7 mm
- Digital zoom
- 22-inch TFT monitor
- Coaxial and oblique LED lighting
- Direct face-up placement
Placement
- Micrometer X/Y motion
- Fine rotary stage
- Placement accuracy: better than approximately ±5 µm depending on process
Process options
- Ultrasonic head
- Eutectic head up to 400°C
- Eutectic workholder up to 450°C
- Reflow workholder up to 250°C or 350°C
- Additional force up to 5 or 12 kg
- Dispenser
- Formic acid process
- Face-down camera
- Y scrubbing
For the complete specification and available configurations, download the official JFP Microtechnic documentation.
Download documentationProcess details
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