Applications
Pick & place
Precision pick and place covers the handling, positioning and placement of dies and other small components onto a substrate or assembly. JFP equipment provides accurate component handling for R&D, prototyping and small-series production.
Equipment for this application
MPS - Manual Placer System
Compact manual placer for accurate pick-and-place of delicate devices, with true vertical vision, flip-chip alignment and options for dispensing, stamping, reflow and eutectic processes.
PP-ONE Automated XZ
Automated micro-placer and sorter for delicate IC devices, laser diodes, sensors and micro-mechanical parts, with wafer handling and dispensing or stamping options.
WB300 Ultrasonic & Reflow Die Bonder
High-accuracy die bonder combining flip-chip vision with thermosonic, thermocompression, eutectic and reflow capabilities.
PP6 Universal Die Bonder
Versatile semi-automatic flip-chip platform for high-accuracy placement and multiple die-bonding processes.
PP7 3D
Multi-level die bonder for accurate placement on packages with different reference heights, including delicate devices such as IR sensors and MEMS.
PP Stacker Unstacker
Automated platform for accurate handling, stacking and unstacking of laser bars with programmable sequences and multi-camera alignment.
PP6 Rework & Die Bonder Station
High-accuracy rework and die-bonding platform for die removal, bond-area preparation, solder-ball removal and precise replacement of delicate devices.
Looking for a specific configuration?
Contact JFP Microtechnic to discuss your process, required accuracy and equipment configuration.
Contact JFP Microtechnic