MPS - Manual Placer System
Compact manual placer for accurate pick-and-place of delicate devices, with true vertical vision, flip-chip alignment and options for dispensing, stamping, reflow and eutectic processes.
Key features
- Accurate pick-and-place of delicate devices
- True vertical motion and Ultra-HD vision
- Flip-chip alignment with video overlay
- Low picking force below 5 g
- Fine X/Y motion with 1 µm resolution
- Compact table-top system
- Rocking head for dispensing and stamping
- Heated workholder and hot-gas options
Technical specifications
System
- Table-top compact machine
- Manual Z movement with soft touch-down
- True vertical motion
- Throat: 200 mm
Die & substrate
- Minimum component size: 100 × 100 µm
- Substrate size: up to 350 mm
- Vacuum tool holders
- WafflePack and GelPack compatible
Vision & alignment
- UHD camera: 5 MP
- Full field of view: up to 10–11 mm
- Digital crosshairs
- Coaxial and oblique LED lighting
- Face-up video overlay
- Optional face-down / flip-chip video overlay
Work stage
- Fine X/Y travel: 25 × 25 mm
- Fine X/Y resolution: 1 µm
- Theta adjustment by rotary base
- Working area: 200 × 200 mm
- Work height: 60 or 100 mm
Process
- Picking force: < 5 g
- Force range: up to 500 g
- Dispensing / stamping capability
- Heated stage 50 mm
- Hot gas option for SMD reflow
- Eutectic die bonding capability
Facilities
- Power: 100 / 230 VAC, 300 W
- Vacuum: integrated
- Dimensions: 270 × 500 × 352 mm
- Weight: 17 kg
For the complete specification and available configurations, download the official JFP Microtechnic documentation.
Download documentationProcess details
Videos
Manual die bonder JFP/MPS
Manual die bonder JFP modele MPS
Related equipment
Need help with your application?
Contact JFP Microtechnic to discuss your process, required accuracy and equipment configuration.
Contact JFP Microtechnic