Applications
Epoxy bonding
Epoxy bonding combines accurate die placement with adhesive attachment to a substrate or package. JFP solutions support epoxy dispensing or stamping and precision placement for a wide range of micro-assembly applications.
Equipment for this application
MPS - Manual Placer System
Compact manual placer for accurate pick-and-place of delicate devices, with true vertical vision, flip-chip alignment and options for dispensing, stamping, reflow and eutectic processes.
PP-ONE Automated XZ
Automated micro-placer and sorter for delicate IC devices, laser diodes, sensors and micro-mechanical parts, with wafer handling and dispensing or stamping options.
PP6 Universal Die Bonder
Versatile semi-automatic flip-chip platform for high-accuracy placement and multiple die-bonding processes.
Looking for a specific configuration?
Contact JFP Microtechnic to discuss your process, required accuracy and equipment configuration.
Contact JFP Microtechnic