PP-ONE Automated XZ

Die Bonders

PP-ONE Automated XZ

Automated micro-placer and sorter for delicate IC devices, laser diodes, sensors and micro-mechanical parts, with wafer handling and dispensing or stamping options.

Key features

  • Automated X transfer and Z placement arm
  • Wafer sorting up to 8 inches standard
  • Low picking force for delicate devices
  • Dual-head dispensing or stamping option
  • Programmable UHD vision and overlay
  • Step-and-repeat placement and dispense patterns
  • Edge-to-edge placement repeatability: 2 µm
  • Flexible platform for standard and customized processes

Technical specifications

System

  • Table-top machine
  • Motorized transfer arm X + vertical Z
  • Vacuum tool holders
  • Dummy cycle: 2,500 cph
  • Manual-stage throughput: up to 600 parts/hour

Die & substrate

  • Chip size: 100 µm to 15 mm
  • Larger chips available by configuration
  • Wafer sorter: up to 8 inches standard
  • 300 mm wafer handling on request

Vision & alignment

  • 2 UHD color cameras: 5 MP
  • Programmable zoom
  • Optical resolution: 2 or 4 µm/pixel
  • Standard field of view: 10 / 15 mm
  • Digital crosshairs
  • 29-inch 16:9 monitor

Workholders & process

  • Working area: 200 × 300 mm
  • Manual or motorized workholders
  • Height-adjustable workholders
  • Picking force: < 6 g
  • Placement force adjustable
  • Edge-to-edge placement repeatability: 2 µm
  • Bond-head X-transfer repeatability: ±5 µm

Options

  • Dual head for stamping / dispensing
  • Wafer eject system
  • Automatic motorized X/Y placement table
  • Inspection camera + zoom
  • Customized workholders

Facilities

  • Power: 100 / 230 VAC, 300 W
  • Dry air: 5 bar
  • Vacuum: 70%
  • Dimensions: 650 × 680 × 620 mm
  • Weight: 50 kg; approximately 60 kg including monitor

For the complete specification and available configurations, download the official JFP Microtechnic documentation.

Download documentation

Process details

PP-One automatic dispense pattern
Dispense pattern
PP-One wafer eject and pick system
Wafer handling
PP-One process camera interface
Process camera

Videos

PP1 - Dispensing

PP1 CHIP 208 560 GelPack&WafflePack

PPOne with stamping manuel

PPone sorting very small chip

Sorter JFP/PPOne

Need help with your application?

Contact JFP Microtechnic to discuss your process, required accuracy and equipment configuration.

Contact JFP Microtechnic