PP-ONE Automated XZ
Automated micro-placer and sorter for delicate IC devices, laser diodes, sensors and micro-mechanical parts, with wafer handling and dispensing or stamping options.
Key features
- Automated X transfer and Z placement arm
- Wafer sorting up to 8 inches standard
- Low picking force for delicate devices
- Dual-head dispensing or stamping option
- Programmable UHD vision and overlay
- Step-and-repeat placement and dispense patterns
- Edge-to-edge placement repeatability: 2 µm
- Flexible platform for standard and customized processes
Technical specifications
System
- Table-top machine
- Motorized transfer arm X + vertical Z
- Vacuum tool holders
- Dummy cycle: 2,500 cph
- Manual-stage throughput: up to 600 parts/hour
Die & substrate
- Chip size: 100 µm to 15 mm
- Larger chips available by configuration
- Wafer sorter: up to 8 inches standard
- 300 mm wafer handling on request
Vision & alignment
- 2 UHD color cameras: 5 MP
- Programmable zoom
- Optical resolution: 2 or 4 µm/pixel
- Standard field of view: 10 / 15 mm
- Digital crosshairs
- 29-inch 16:9 monitor
Workholders & process
- Working area: 200 × 300 mm
- Manual or motorized workholders
- Height-adjustable workholders
- Picking force: < 6 g
- Placement force adjustable
- Edge-to-edge placement repeatability: 2 µm
- Bond-head X-transfer repeatability: ±5 µm
Options
- Dual head for stamping / dispensing
- Wafer eject system
- Automatic motorized X/Y placement table
- Inspection camera + zoom
- Customized workholders
Facilities
- Power: 100 / 230 VAC, 300 W
- Dry air: 5 bar
- Vacuum: 70%
- Dimensions: 650 × 680 × 620 mm
- Weight: 50 kg; approximately 60 kg including monitor
For the complete specification and available configurations, download the official JFP Microtechnic documentation.
Download documentationProcess details
Videos
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Sorter JFP/PPOne
Related equipment
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