Applications
Wafer-level placement
JFP Microtechnic equipment related to this application.
Equipment for this application
PP-ONE Automated XZ
Automated micro-placer and sorter for delicate IC devices, laser diodes, sensors and micro-mechanical parts, with wafer handling and dispensing or stamping options.
PP6 Universal Die Bonder
Versatile semi-automatic flip-chip platform for high-accuracy placement and multiple die-bonding processes.
Looking for a specific configuration?
Contact JFP Microtechnic to discuss your process, required accuracy and equipment configuration.
Contact JFP Microtechnic