Applications
Die bonding
Die bonding, also known as die attach, covers the placement and attachment of semiconductor dies or other microelectronic components onto a substrate, package or device. Depending on the application, processes include adhesive, eutectic, reflow and thermocompression bonding.
Equipment for this application
MPS - Manual Placer System
Compact manual placer for accurate pick-and-place of delicate devices, with true vertical vision, flip-chip alignment and options for dispensing, stamping, reflow and eutectic processes.
PP-ONE Automated XZ
Automated micro-placer and sorter for delicate IC devices, laser diodes, sensors and micro-mechanical parts, with wafer handling and dispensing or stamping options.
WB300 Ultrasonic & Reflow Die Bonder
High-accuracy die bonder combining flip-chip vision with thermosonic, thermocompression, eutectic and reflow capabilities.
PP6 Universal Die Bonder
Versatile semi-automatic flip-chip platform for high-accuracy placement and multiple die-bonding processes.
PP7 3D
Multi-level die bonder for accurate placement on packages with different reference heights, including delicate devices such as IR sensors and MEMS.
PP6 Rework & Die Bonder Station
High-accuracy rework and die-bonding platform for die removal, bond-area preparation, solder-ball removal and precise replacement of delicate devices.
Looking for a specific configuration?
Contact JFP Microtechnic to discuss your process, required accuracy and equipment configuration.
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