Micro-assembly

MPS - Manual Placer System

Compact manual placer for accurate pick-and-place of delicate devices, with true vertical vision, flip-chip alignment and options for dispensing, stamping, reflow and eutectic processes.

PP-ONE Automated XZ

Automated micro-placer and sorter for delicate IC devices, laser diodes, sensors and micro-mechanical parts, with wafer handling and dispensing or stamping options.

PP6 Universal Die Bonder

Versatile semi-automatic flip-chip platform for high-accuracy placement and multiple die-bonding processes.

PP7 3D

Multi-level die bonder for accurate placement on packages with different reference heights, including delicate devices such as IR sensors and MEMS.