Applications
Flip-chip / flip alignment
Flip-chip assembly requires accurate face-down alignment and placement of a die onto a substrate or device. JFP equipment supports precision flip-chip alignment for microelectronic and optoelectronic assembly applications.
Equipment for this application
MPS - Manual Placer System
Compact manual placer for accurate pick-and-place of delicate devices, with true vertical vision, flip-chip alignment and options for dispensing, stamping, reflow and eutectic processes.
WB300 Ultrasonic & Reflow Die Bonder
High-accuracy die bonder combining flip-chip vision with thermosonic, thermocompression, eutectic and reflow capabilities.
PP6 Universal Die Bonder
Versatile semi-automatic flip-chip platform for high-accuracy placement and multiple die-bonding processes.
Available with optional configuration
PP7 3D
Multi-level die bonder for accurate placement on packages with different reference heights, including delicate devices such as IR sensors and MEMS.
WB200e Manual & Semi-automatic Wire Bonder
Multi-purpose wire bonder for R&D, prototypes and small series, supporting manual, semi-automatic and optional Auto-Bond operation.
PP6 Rework & Die Bonder Station
High-accuracy rework and die-bonding platform for die removal, bond-area preparation, solder-ball removal and precise replacement of delicate devices.
Looking for a specific configuration?
Contact JFP Microtechnic to discuss your process, required accuracy and equipment configuration.
Contact JFP Microtechnic