WB200e Manual & Semi-automatic Wire Bonder
Multi-purpose wire bonder for R&D, prototypes and small series, supporting manual, semi-automatic and optional Auto-Bond operation.
Key features
- Ball, wedge, bump and ribbon bonding
- Manual, semi-automatic and optional Auto-Bond modes
- Motorized X/Y and Z axes
- Fine-pitch bonding capability
- Programmable loop formation
- Deep-access bond head
- Optional vertical video microscope
- Vibration-free high-accuracy design
Applications
Optional configurations
Technical specifications
System
- Bond arm length: 165 mm
- Full throat: 200 mm
- Motorized Z travel: 40 mm
- Z resolution: 0.23 µm
- Motorized X/Y: 100 × 100 mm
- X/Y resolution: 0.23 µm
Bonding
- Ultrasonic power: 0–5 W
- Transducer: 62 kHz standard
- Bond force: 10–150 cN programmable
- Bond time programmable
- Gold wire: 17–50 µm
- Aluminium wire: 17–50 µm
- Ribbon: 40–250 µm wide, 12–25 µm thick
Modes & vision
- Semi-Auto with microscope
- Full Manual Z with microscope
- Auto-Bond with vertical camera and multi-height focus
- UHD 5 MP camera
- Standard FOV approximately 2.7 mm for fine pitch
- Digital zoom and digital crosshair
Workholder
- Heater stage up to 250°C
- Temperature accuracy: ±1%
- Height adjustment: ±10 mm
- Package thickness up to 110 mm
Facilities
- Electrical: 100 / 240 V, 50–60 Hz
- Current: max. 5 A
- Dimensions: 640 × 710 × 550 mm
- Weight: 60 kg
For the complete specification and available configurations, download the official JFP Microtechnic documentation.
Download documentationProcess details
Videos
Project wb200 ball 360
WB200, indexer ball bonding
Related equipment
Need help with your application?
Contact JFP Microtechnic to discuss your process, required accuracy and equipment configuration.
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