MPT Manual Pull Tester
Compact pull tester for destructive and non-destructive evaluation of bond quality on fine bonded wires.
Key features
- Bond-quality pull testing
- Destructive and non-destructive testing
- Wire diameter range: 15–100 µm
- Multiple pull-test ranges
- Compact and robust design
- Fine X/Y + Theta stage available
- Vacuum-held parts
- Optional binocular / trinocular vision
Applications
Technical specifications
Test system
- Pull ranges: 1.5–15 g, 3–30 g, 5–50 g, 10–100 g, 25–250 g
- Adjustable preset value for non-destructive testing
- Manual Z level
- Quick vertical slide: 10–150 mm
Workholder
- Working platform: 200 × 200 mm standard
- Parts held by vacuum
- Fine X/Y + Theta option: 25 × 25 mm travel
- Fine-stage resolution: 1 µm
Facilities
- Power: 100 / 230 VAC, 30 W
- Dimensions without stand: 250 × 200 × 250 mm
- Weight without stand: 2 kg
For the complete specification and available configurations, download the official JFP Microtechnic documentation.
Download documentationProcess details
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