Applications
Wire bonding
Wire bonding creates electrical interconnections between semiconductor devices and their package, substrate or circuit using fine wire or ribbon. Depending on the application and materials, different bonding processes and configurations can be used.
Equipment for this application
WB100e Manual & Semi-automatic Wire Bonder
Versatile manual and semi-automatic wire bonder for R&D, prototypes and small-series production, with wedge and ball bonding capability.
WB200e Manual & Semi-automatic Wire Bonder
Multi-purpose wire bonder for R&D, prototypes and small series, supporting manual, semi-automatic and optional Auto-Bond operation.
Looking for a specific configuration?
Contact JFP Microtechnic to discuss your process, required accuracy and equipment configuration.
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