Applications

Thermocompression bonding

Thermocompression bonding uses controlled heat and force to create a bond between components without ultrasonic energy. JFP equipment provides accurate alignment, placement and controlled process conditions for thermocompression applications.

Equipment for this application

WB300 Ultrasonic & Reflow Die Bonder

High-accuracy die bonder combining flip-chip vision with thermosonic, thermocompression, eutectic and reflow capabilities.

Looking for a specific configuration?

Contact JFP Microtechnic to discuss your process, required accuracy and equipment configuration.

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