Applications

UV curing

JFP Microtechnic equipment related to this application.

Equipment for this application

UV810 - UV Curing System

Compact UV-A 365 nm curing system for UV tape used in wafer dicing and back-grinding processes.

Available with optional configuration

Optional configuration

PP6 Universal Die Bonder

Versatile semi-automatic flip-chip platform for high-accuracy placement and multiple die-bonding processes.

Optional configuration

PP6 Rework & Die Bonder Station

High-accuracy rework and die-bonding platform for die removal, bond-area preparation, solder-ball removal and precise replacement of delicate devices.

Looking for a specific configuration?

Contact JFP Microtechnic to discuss your process, required accuracy and equipment configuration.

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