UV810 - UV Curing System
Compact UV-A 365 nm curing system for UV tape used in wafer dicing and back-grinding processes.
Key features
- UV-A 365 nm curing
- Designed for UV curing tape
- Wafer on ring or frame
- Low-temperature process
- Ozone-free operation
- Nitrogen flow
- Compact table-top design
- Simple setup and operation
Applications
Technical specifications
Process
- UV wavelength: 365 nm
- Low-temperature process
- Nitrogen purge
- Suitable for wafer dicing and back-grinding tape
Capacity
- Nominal size: 8 × 10 inches
- Wafer on ring
- Wafer on frame
Facilities
- Voltage: 100 / 230 VAC
- Dimensions: 320 × 350 × 120 mm
- Weight: 4 kg
For the complete specification and available configurations, download the official JFP Microtechnic documentation.
Download documentationRelated equipment
Need help with your application?
Contact JFP Microtechnic to discuss your process, required accuracy and equipment configuration.
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